Monthly Roundup: February

Continuing the new feature we started last month, here’s your monthly roundup of media coverage, awards, application notes and technical articles for February 2012 (and one item from March 1, because we just couldn’t wait until next month to share it).

Amplifiers

• “Maximum Slew Rate on High-Voltage Pins for TPA3111D1,” February 1, 2012. (Application Note)

• “A Current Sensing Tutorial – Part 1: Fundamentals,” Industrial Control Designline, February 8, 2012.

• “A Current Sensing Tutorial – Part 2: Devices,” Industrial Control Designline, February 15, 2012.

• “LMP8278Q MSOP Evaluation Board User’s Manual,” February 23, 2012. (Application Note)

• “Precision Current Limiting with the LMP8646 and LM3102,” February 24, 2012. (Application Note)

• “Precision Current Limiting with the LMP8646 and LMZ12003,” February 24, 2012. (Application Note)

• “Precision Current Limiting with the LMP8646 and LP38501,” February 27, 2012. (Application Note)

• “A Current Sensing Tutorial – Part 3: Accuracy,” Industrial Control Designline, February 29, 2012. (Technical Article)

Clocks

• “TRF3765 Synthesizer Lock Time,” February 6, 2012. (Application Note)

• “Signal Chain Basics #61: Clock jitter demystified – random jitter and phase noise, Part 2,” EETimes Europe, February 13, 2012. (Technical Article)

Data Converters

• “High-speed DAC and ADC family,” Microwave Journal, February 14, 2012. (Media Coverage)

• “TI’s Analog Marketing Director in Europe: the merge with National took six months,” Techtime, February 19, 2012. (Media Coverage)

• “MSP430 Interface to LMP90100 Code Library,” February 22, 2012. (Application Note)

• “Band-Pass Filter Design Techniques for High-Speed ADCs,” February 27, 2012. (Application Note)

• “Texas Instruments to Perform LTE demo of 1.5GHz CMOS DAC for 3G/4G Basestations at Mobile World Congress,” EE Daily News, February 27, 2012. (Media Coverage)

• “Leadless Leadframe Package (LLP) (Rev. Q),” February 28, 2012. (Application Note)

• “Mobile World Congress 2012, Day 4: The final day of the 2012 Mobile World Congress found new semiconductors, innovative applications, and creative testing techniques,” Test & Measurement World, March 1, 2012. (Media Coverage)

• EETimes China ACE Awards, Mixed Signal Controller/Processor/System on Chip (SoC) of the Year category, ADS1298R. (Award)

• EETimes China ACE Awards, Data Converter of the Year category, ADC12Dxx00RF. (Award)

General Analog

• “Eight ways to improve RF spurious performance,” RF & Microwave DesignLine, February 27, 2012. (Technical Article)

Interface

• “Five Questions with Sanjay Gajendra of Texas Instruments,” ECN, February 1, 2012. (Media Coverage)

• “TPD12S016 PCB Layout Guidelines for HDMI ESD Protection,” February 6, 2012. (Application Note)

• “DesignCon Take 2: Floating Point for FPGAs and TI’s Signal Integrity Solutions,” Electronic Engineering Journal, February 10, 2012. (Media Coverage)

• “HDMI/DVI to LVDS Bridge,” February 15, 2012. (Application Note)

• “Signal Chain Basics #62: Design your own simple I2C industrial interface isolator,” EETimes Europe, February 16, 2012. (Technical Article)

• “PhyworkX Ethernet PHY Development Kit,” February 27, 2012. (Application Note)

Sensors

• “Designing with temperature sensors, part four: thermocouples,” EDN Europe, February 1 2012. (Technical Article)