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Packaging innovation on display at Semicon West 2012
Semicon West has wrapped up in San Francisco, but TI had a significant presence in “The Power of Packaging” track of the conference.
For years, TI has been revolutionary in this realm – setting industry standards for how chips are packaged each step of the way. The results have been significant, too – with reduced chip size and cost as well as increased performance.
Dr. Sreenivasan Koduri, a TI Fellow, spoke to these advancements in his keynote as part of the “Contemporary Packaging: Achieving Cost Advantage Through Innovation” segment.
TI also has been a leader in developing new technologies, including a 3D packaging model that has reduced packaging sizes by 50 percent. Such innovations are the results of TI’s continued commitment to research and development. Dave Stepniak, TI’s Analog Development and Execution Packaging Manager, was part of a panel exploring the collaboration between the ecosystem and research and development.
Check out TI.com for the latest on TI’s packaging leadership and expertise, including a number of whitepaper and video resources on the subject.
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