I hope you have had the chance to enjoy some holidays over the summer. Here where I live things are just about getting up to speed again. Just before the summer, the Bluetooth SIG launched the Bluetooth Innovation World Cup. This is a Bluetooth SIG initiative that Texas Instruments have chosen to sponsor. The basic premise is that the Innovation World Cup is a competition where the goal is to come up with new, innovative product ideas or concepts that are enabled by Bluetooth low energy.
The competition focuses on the sports, fitness and sports-related health care markets, and runs from June 1st to October 31st. The best idea will receive €5000 as well as a voucher for Bluetooth qualification. The winner and three runners-up will also be provided with exhibition space in the Wearable Technologies Area at the ispo Winter 2010 trade show (this is the world's biggest sporting goods trade show). The judging criteria include level of innovation, uniqueness, technical feasibility and market attractiveness. Of course, the winner and the runners-up will also get some good free publicity out of this.
Here at TI, we are excited to be involved with the Innovation World Cup as we believe that Bluetooth low energy opens up a lot of new possibilities because of the low power consumption and flexible profile architecture. We will be following the competition closely and are very interested to see what innovative concepts will surface.
If you think you have a good idea or concept, go to http://bluetooth.com/Bluetooth/Press/Bluetooth_World_Innovation_Cup.htm to get more information about the Innovation World Cup and find out how to sign up.
Also check out our new Bluetooth low energy web site at www.ti.com/bluetoothlowenergy.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.