The Bluetooth Innovation World Cup is now in it's third year, and TI is this year taking the role of Title Sponsor for the event. This year is more exciting than ever, since ICs, software and development kits are now available and the focus is therefore on real prototypes and products.
By serving as Title Sponsor, TI is not only powering the competition financially, but TI will also give out free Bluetooth low energy development kits to the first 20 developers who submit prototypes for the competition. Developers who submit prototypes after the free kits are gone, will be offered a 50% price discount. More information about TI's CC2540 single-mode Bluetooth low energy system-on-chip device can be found here.
The Bluetooth SIG will being accepting entries for this year's contest on May 1st, 2011. More information about the Innovation World Cup can be found here. A press release about TI's sponsorship can be found here.
I'm really looking forward to seeing the submissions this year!
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