New at CES
DLP 4K UHD technology on display in Hisense keynote: Dave Duncan, Business Unit Manager for the DLP Products® Enterprise and Cinema Display organization spoke about advances in DLP 4K ultra-high-definition (UHD) technology during the Hisense keynote at CES on Jan. 8. Read more about the DLP technology that enables 4K UHD laser TVs to project crisp images up to 100 inches on a variety of surfaces.
TI customers showcase new technology at CES: Our customers unveiled several new solutions in the opening days of CES. From the new Benchmark® 4.0 biometric sensor system from Valencell featuring our analog front-end technology to the breakthrough 4K ultra-high definition laser TVs from Hisense featuring our DLP® 4K UHD chipset, our customers are showing new and innovative solutions throughout the week. Also featured at CES: WiTricity’s electric vehicle wireless charging solution leveraging our C2000TM MCUs, the DigiLens MonoHUD augmented reality (AR) helmet featuring DLP® Pico™ technology, and a miniature high-performance optical light engine for augmented reality created by Coretronic using our DLP® Products technology. Stay tuned for more updates from CES.
Stay tuned to our official Facebook page all week for live updates from the show. We’re talking in-depth about the latest tech driving the automotive industry and new features emerging for smart automation in homes, buildings and factories. Watch our experts weigh in on the biggest trends at CES, what they mean for developers, and how it will all impact the next generation of consumer electronics and automotive systems.
Many aspects of our world – the cars we drive, the factories we rely on to manufacture products, the homes where we live, the offices where we work, our cities – are getting more automated and more intelligent every day. And the Consumer Electronics Show (CES) is a great place to check out the cutting-edge technologies from our company that are enabling and accelerating this wave of innovation. Visit our company at CES Jan. 9-12 in rooms N115-N117 in the North Hall at the Las Vegas Convention Center to see what’s next:
Advanced automotive systems: Check out technologies enabling an immersive driving experience, including sensing, intelligence and control for advanced driver-assistance systems (ADAS), complex body electronics systems, and more efficient electric vehicle (EV) charging solutions. Experience what’s next for ADAS based on Jacinto™ TDAx processors, mmWave radar sensors and connected car-access systems using our wireless technology.
Next-generation infotainment and cluster systems are creating interactive experiences through integrated informational, entertainment and multimedia functions. See what’s next for digital cockpits, DLP® technology for automotive, driver monitoring and hands-free control. Smart automation: Get an in-depth view of some of the technologies that are helping to revolutionize automated systems in buildings, including our homes, offices and factories. We will feature sensors for occupancy detection, high-definition smart-home solutions and scalable SimpleLink™ microcontrollers.Displays: From augmented reality to 3D scanning and 4K displays, our company’s DLP technology is transforming consumer electronics. Discover what’s next in high-definition displays, portable displays and mobile head-up displays (HUDs) in person. We hope to see you at CES Jan. 9-12. If you’re not attending in person, follow this blog for real-time updates and monitor us on social media for the latest:
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.