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Day 1 Recap: On the ESC show floor at DESIGN West
Today at DESIGN West, the ESC show floor opened as developers of all ages learned more about their favorite embedded processors and applications. The TI camp remained busy all day between attendees checking out demos and the media stopping by to learn about what new technology TI has up its sleeves.
Among the many exciting activities during the show today, TI announced the Audio Capacitive Touch BoosterPack based on the MSP430 MCU LaunchPad. The new BoosterPack enables new functionalities in microcontroller applications, including crystal clear audio with playback and recording capabilities, so we have been jamming out in our booth all day! If you haven’t seen it in person yet, be sure to stop by the booth tomorrow (and, yes, you can get your hands on one of these for only $30 for a limited time!).
In addition to experiencing various MCU, single-core DSP processor, wireless connectivity, multicore and medical demos, attendees were able to take a peek at the BeagleWall in action. The recently announced BeagleBone was also a hit, especially as part of the popular MCU “Tool Swap” program, encouraging developers to Make the Switch to TI MCUs.
Not able to make it to the show this year? No worries! Visit TI’s Facebook page for photos and videos of TI’s booth activities and demos, and follow TI on Twitter (@TXInstruments) for continuous updates.
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