Forums - E2E Suggestions & Feedback Forum - Learn E2E

Quick Packaging Survey - How can we improving our packaging at TI?

This question is not answered

Posted by Blake Ethridge

on Aug 31 2011 18:24 PM

Mastermind18505 points

Thanks in advance for any feedback that you provide!

How easy is it to find package information on our website?
How easy is it to get support from TI on packaging questions?
What do you think about our packaging technology, quality, and offering?
Is package type a differentiator when selecting a part? Why?

Blake Ethridge, Social Media Community Engagement Manager, Texas Instruments

E2E Blog - Stay up to date on all E2E news and updates | About E2E | Updating Your Avatar

All Replies

Posted by geetansh arora

on Sep 01 2011 10:12 AM

Prodigy10 points

i have been using estore for quite a while now n packaging has never been an issue.

its quite easy to find package info on ur site.

never tried getting support on it.

quality n offering are good,no problem about them.

package can be a differentiator while selecting a part for comapnies bcoz when used in bulk quantity for mass production desired package is necessary n if its not available then one might go for other device. its just my view,i m student so dont know much about it.

Posted by Sheetal Pandey

on Oct 11 2011 01:28 AM

Prodigy10 points

Packaging information is just perfectly given on TI's website. I would say TI's websites has one of the best technical specifications available on th eweb.

Posted by Roberto Romano

on Nov 13 2011 12:42 PM

Mastermind6840 points

Hi, I used TI estore many times and problem arise from site malfunction than search and packaging, this site appear as it is M$ hosted and too many time fail or hurt who like me don't like to be M$ dependent.

About shipping sometimes items come in separate pack so as a recycle and environment saver a single shipment was on my wish.

Regards

Roberto

Regards

Roberto

Please login & click Verify Answer if this post answered your question.

Posted by vishal patil

on Dec 10 2011 03:17 AM

Prodigy80 points

TI provide good packaging. I don't Think there should be any change. and we can get lots information on website. But I have sometimes problem with www.ti.com. Lots of time

server has lots of load. so many times I can't access web site. TI should provide another mirror to decrease load on server. Thanking you.

Posted by Joe Desbonnet

on Feb 16 2012 21:45 PM

Intellectual315 points

I thought about that hard for about a minute, and you know... I can't think of anything wrong or even any improvements on the packaging. If ever I need stuff packaged en-mass I'll be stealing your ideas :-) Well done!

Posted by Gaston Picard

on Apr 11 2012 10:35 AM

Prodigy30 points

How easy is it to find package information on our website?

Very easy. No problem at all. However there are differences that are not obvious that go unexplained and can lead to uncertainties at the time of ordering. This is, some chips names have differences that are not clarified neither in the spec sheets nor in the package information. I.e. what's the difference between a DIR9001PW, a DIR9001PWR and a DIR9001PWRG4? The tree are the same chip, the three are TSSOP, the first two differ in that the first is delivered in tubes and the second in reels... but what about the G4?

How easy is it to get support from TI on packaging questions?

Never tried it.

What do you think about our packaging technology, quality, and offering?

The offering is pretty good. I think the options are right for the needs. However I would value if DIP or PDIP packaging were available for more products.

Is package type a differentiator when selecting a part? Why?

Always. Some people purchase for small, hand soldered batches, while other needs highly integrated and dense packaged design. Surface mount can be hand soldered to some extent. Offering only the highest density, besides barring people from testing the technology before buying (at least without the need of expensive prototyping setup), is a set-back for small companies or others that are willing to use manpower instead of robotics for mounting. It also goes against "repairability" and support when aiming not at board-level-repair but at component-level.