Part Number: TAS5624A
My customer facing some market feedback due to D-amp IC broken.
This D-amp IC broken caused by mechanical heatsink vibration which make some IC pin break.
Customer would like to understand how much kg/f can stand for screw torque or maximum load (kg) withstand when the heatsink mounted on top of the IC.
Customer wants to study to improve vibration to avoid broken pin IC with strengthen the screw torque of the heatsink.
Please provide heatsink mounting data(screw torque) /recommendation for HTSSOP or similar IC package.
In reply to Wee Keat Chin:
In reply to Adam Sidelsky:
Your inference could be correct as customer found out that some of the protruding supports on the heatsink bracket are out of specs(height shorter).
Hence the heatsink is not fully supported and sitting on the PCB. This failure is so rare as it only happened in one model, coincidentally the heatsink and heatsink bracket used is different from others.
Customer now is simulating to reproduce the failure. Since vibration is the suspected culprit, their study approach could be finding the resonance frequency.
Customer wants to understand whether TI happens to encounter similar failure or comments about the resonance frequency that could lead to break the IC pins.
For the correct thermal performance, do you mean that the minimum torque required in order to achieve the thermal conductivity as stated in the datasheet?
Example refer to the silicone pad, the thermal conductivity is 1.7W/mK [ISO 22007-2]
TI uses a heatsink such as the following for the TAS5624:
As you can see from the image, the heatsink has feet that touch the PCB on both top and bottom of the IC, also no thermal pad is used, the heatsink rests directly on the IC with thermal paste applied.
Since we have two square feet touching the PCB surface and no thermal pad, this heatsink is very sturdy.
We have not heard of any issues like this from other customers.
The minimum torque mentioned is based on our findings for the amount of torque needed to give us adequate thermal performance in our application.
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.