Hi.
I will use a TPA711 in my design.
My doubt is: Can I short-circuit the thermal pad under the IC to the GND signal (pin 7 of TPA711)?
This could reduce the resistance between ground points of my current circuit.
Can I short to GND?
Regards.
3441.TPA711 - 700-mW Mono Low-Voltage Audio Power Amplifier.pdf
Hi, Jeferson,
Not only CAN you, you most definitely should! And, throw a couple vias in there to tie the top and bottom grounds together. Note the footprint on page 35 of the d/s.
This helps immensely with power dissipation. Please check out our app note on PowerPAD(tm).
-d2
-----
Don Dapkus
Audio Applications Engineering Manager
Dallas, TX USA
This is my current PCb layout for the audio amplifier with TPA711:
I did a little jumper (in yellow above) to connect the PowerPAD to ground signal. So I can directly connect the powerPAD to ground, right? I will do that. I did two vias near the power pad. At the other side of the PCB I will add a copper area to reduce Rth.
The output of the 5V power supply is very close to TPA711 supply pins
ANOTHER QUESTION:
I am using these decoupling ceramic caps on BTL, Bypass, and VCC pins:
- Very close to VCC and GND pins there are 2x 10uF ceramics 0805 X5R + 1x 100nF ceramic 0603 X7R
- 100nF X7R 0603 on BTL
- 1uF X5R 0805 on Bypass
About the caps on BTL and Bypass pins, these are the recommended values?
This is my current schematic:
OBS: This circuit will be used (drive the speaker) for around 6 seconds each minute.
Waiting you reply. Regards.
Please see Figure 51 in the d/s, and read the sections after that for component value discussions.
You can also check the tpa711msopevm for the values we used on the EVM.
Hi. The TPA711 I will use is SOIC-8 package.
I would like to know if there are another ICs produced by TI/NI, with the same pinout of TPA711.
So I can test my amplifier with more than one IC and have possible substitute part numbers case I can't find the TPA711 for buy before producing the PCBs.
I need help to choose the package of TPA711 for my project.
HELP:
Currently I'm doing the project, I didn't started production yet. And I will start producing by buying the ICs from Digikey. Searching for "TPA711" on Digikey website, there are 900 pcs available for the SOIC-8 and 10.000 pcs available for the MSOP-8 package. Maybe it will be better to switch to MSOP-8 package instead of using the SOIC-8?Is this IC more available in MSOP package than SOIC-8? I can use both of them, for me is indifferent. I just want to find the IC easier. Do you have a recommendation?
http://www.digikey.com/product-search/en/integrated-circuits-ics/linear-amplifiers-audio/2556583?k=TPA711
Hello Jefferson:
If you refer to the table on ti.com for the TPA711, it appears that the other devices in the TPA7xx family will work for your application based on your schematic.
For one or two of the cases, you may need to add 0 Ohm resistors to configure the inputs and logic.
If this is not clear, I will be gald to assist you.
By the way, why do yo have SE/BTL coupled to GND through a cap?
Rgds,
Fred
Which are the other part numbers compatible with TPA711?
SE/BTL is coupled to GND because I saw this config in another PCB I have here with the TPA711. But I can put a resistor or a jumper to GND also... What is better?
Hello Jeferson:
For a logic signal SE/BTL, I suggest a 0 Ohm Resistor.
The other options, with stuffing options for each case:
There are others, so let me know if you need more.
I would like to have more options, with exactly the same pinout of the TPA711, with SOIC-8 package. So I can use my current PCB (was made for SOIC-8, not MSOP-8)
Hi Jefferson:
The TPA311 has the same pinout as the TPA711; howver, it is limited to 350mW output.
If you modify your design slightly to the TPA731, the TPA721 and TPA741, could be used on your PCB.
I will buy some samples of TPA311 SOIC-8. And I iwll test with BTL pin tied to GND.