Thermal specifications and power dissipation of LME49720

Hi Yoshiki,

I will try to find the information for you.

Andy 

Hi Yoshiki,

See my comments below:

1.Thermal resistance (SOIC package)

2.Junction temperature (Do you have a material such as characteristic graph of temperature change?)(SOIC package)

Comment : I think you can find the data on the Page 3 of the LME49720 datasheet.

3.Power Dissipation(SOIC package)

Comment : Since It is not available ("Internally Limited") in the datasheet, I have to double check with my colleague.

Andy

Hello Andy-san,

Thank you for your reply.

I  will answer to the customer about No.1,2 questions.

Please contact me if you have additional information about the power dissipation.

Best Regards,

Y.Hasebe

Hi Yoshiki,

Sorry for my late response on your 3rd question.

Here is an equation about allowable power dissipation.
Pdmax=(Tjmax-Ta)/θja
Where
Pdmax: Allowable maximum power dissipation
Tjmax: Maximum junction temperature, in this case 150 deg C
Ta: Ambient temperature. Maximum system operating temp
Θja: Junction to Ambient thermal resistance. In this case it is 145 C/W for SOIC
So max power dissipation will depend on how high the operating temperature is.

Andy

Hello Andy-san,

Thank you for your reply.

I will answer above comments to my customer.

Best Regards,

Y.Hasebe