What is your recommended way to fan-out a TPA6166A2?
The evaluation board seems to use 0.15 mm plugged vias-in-pads, but our fab needs min 0.2 mm to do plugged vias.
What's your take on:
1. microvias in pads
2. dog-bone fanout?
For #2, what via hole and annular ring size is recommended? Following the datasheet guidelines for footprint (0.23 mm pad, 0.31 mm solder mask opening) leaves very little room for vias as the annular ring will be exposed in the solder mask openings.
Best,
Jon
