I'm using TPA2016D2 stereo 1.7W/8ohms class-D amplifier in QFN20 package. My question is : Can I connect the thermal pad of this device to the ground plane ?
There's no information like "The thermal pad must be connected to" in the documents so I assume that I can connect it to the ground, like any QFN based device I've seen so far. Is this right ?
Thanks for your help !
You are correct. Connect the TPA2016D2 QFN thermal pad to the ground plane. Although no current flows through the thermal pad, it helps dissipate heat from the die and secures the package more firmly to the board.
Thanks for your help Troy!
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