Hello,
I had your recommendation as following from TI-Japan local support team.
" The maximum force to TPA3251 (DDV package ) is 95N maximum"
I had transgfered to it to my customer , but I had 3 questions from customer.
I had made the figure for explanation ( attached )
Please kindly advise.
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Q1 My understanding for the Force to IC is F=80N,if the condition was in the figure ( please reffer attached ) .Is it make sense?
Q2 What value of F is recommended for IC? F should be greater than > 20N ? I had referred irf’s app note AN-997.
Q3 The H of heatsink is H=1.0mm for TPA3152EVM’s heatsink , On the other hand, height of DDV is 1.2mm max.
That is to say, minus value:-0.2mm of tolerance is recommended by TI.
If there were no bend of PCB, mechanical force is seemed to be applied to IC’s lead…. Is it no problem?
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Warmest Regards