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TPA3251D2 package height and Heatsink

Other Parts Discussed in Thread: TPA3251

Hello,

I had  your recommendation as following  from  TI-Japan local support team.

" The maximum force to TPA3251 (DDV package ) is 95N maximum"

I had transgfered to it to my customer , but I had 3 questions from customer.

I had made the figure for explanation ( attached )

 

Please kindly advise.

 

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Q1 My understanding for the Force to IC is F=80N,if the condition  was in the  figure  ( please reffer attached ) .Is it make sense?

 

Q2 What value of F is recommended for IC?   F should be greater than > 20N ?   I had referred  irf’s app note AN-997.   

 

Q3  The H of  heatsink is H=1.0mm for TPA3152EVM’s heatsink ,  On the other hand, height of DDV is 1.2mm max.

That is to say, minus  value:-0.2mm of tolerance is recommended by TI.

If there were no bend of PCB, mechanical force is seemed to be applied to IC’s lead….  Is it no problem?  

 

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Warmest Regards