Hi Engineers,
Could you tell me how many pressure (N/mm2) is to provide good mechanical, thermal and electrical contact with PowerPAD? and how many pressure is limit for TAS5614LA?
Regards,
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Hi Engineers,
Could you tell me how many pressure (N/mm2) is to provide good mechanical, thermal and electrical contact with PowerPAD? and how many pressure is limit for TAS5614LA?
Regards,
Hi Matthew,
Thank you for your reply. I understand 1 maximum pressure is 1.1N/mm2.
Based on this value, how much gap between heatsink and DAMP is allowable?
At TI EVM Heatsink for DDV package, the gap between heatsink and DAMP is 1.02mm center.
This value looks like setting the center of DAMP thickness without pin height.
However DAMP thickness has 0.1mm tolerance and pin height is 0.1mm center. On the other words, the maximum height for DAMP is 1.2mm with pin height.
My question is that how much pressure you estimate to DAMP in this worst case (maximum height : 1.2mm vs gap : 1.02mm).
Regards,
Hello,
Yes you are correct. The heatsink allows for a 1mm gap where as the DDV is 1.2mm tall. With this height difference, we insure that the heatsink is always in contact with the DDV PowerPAD. Mounting pressure is controlled through the torque of heatsink mounting screws.
The mounting pressure can be calculated based on the screw size and thread pitch for a given torque. This will need to be calculated based on the contact area for your heatsink and the screws you plan to use.
Best Regards,
Matt