Dear Sir/Madam,
The LM3886 datasheet is for both the NDJ and the NDA package (resp. LM3886T, LM3886TF).
Nevertheless, there is only one thermal resistance between J-C specified (which is 1 degC/W). I would expect a higher value for the NDA package than for the NDJ package because of the insulating layer present between the internal heat-dissipating plane and the part's external mounting plane.
In our application we need insulation to the heatsink. The LM3886TF would provide this, but we don't want to have a higher temperature rise than we have with the LM3886T i.c.w. a good (low thermal resistance) insulating sheet.
Can someone comment on this?
Thank you.
