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TAS5731M: Need Heat Sink Suggestion for the TAS5731M

Part Number: TAS5731M

Hi Sirs,

If customer want add a heat sink to reduce operating temperature of the TAS5731M, would you pls advise if we should place a heat sink on the top of the TAS5731M package, or the opposite side of the TAS5731M under exposed area of thermal vias?

Thank you and Best regards,

Wayne Chen

03/20/2017

  • Hi Wayne,

    The TAS5731M is a pad down device so the exposed thermal pad on the bottom of the device uses the PCB as a heat sink. Under the specified operating conditions and good PCB routing the board will provide enough thermal mass to dissipate heat from the device. I would first check the PCB layout as the best way to cool the device. Adding a heatsink on top of the device can help to cool it, but should not be necessary with good PCB layout. As to your question of placing the heatsink on the top or bottom, it would depend on the specific layout of the PCB and is not something we usually do with the pad-down devices so that is hard for me to answer.

    Best,

    Alex

  • Thank you for your elaboration, Alex. I will send customer 's board file by Email once available....Wayne Chen