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TAS5782M: Junction Temperature for Digital Die when Detecting OTE

Part Number: TAS5782M
Other Parts Discussed in Thread: TAS5754M

Hi,

The junction temperature for the digital and power die is mentioned on page 9 of TAS5782M datasheet, the over temperature error is also mentioned on page 12.
I am concerned that it will affect the digital die when the junction temperature on the power die rises because the digital die and the power die are adjacently placed in the package.
So, is there a possibility that the junction temperature will rise more than 125℃ on the digital die and the malfunction will be caused when detecting the over temperature error(more than 165℃) on the power die ?

Best regards,
Kato

  • Hello Kato-san! This adjacent die concept is very common to many of our parts for many years, including some that go into the 100's of watts. We test and characterize our devices as a complete package and set all spec thresholds and limits based on the overall effect of the total packaged device. So this means that these extremes are factored in to the operation of the device and therefore you should have no problem in your design. Thanks, Jeff
  • Hi Jeff-san,

    Thank you for your prompt reply.

    I am also concerned that the threshold is higher than other similar devices(e.g. TAS5754M/56M) because the threshold for the over temperature error on TAS5782M is 165℃(typical).
    So, I believe that is no issue but would like you to confirm just in case.

    Best regards,
    Kato

  • Hello Kato-san!

    This is a standard test for such devices. When stressed the heat is mainly distributed at the Power Die, and does not greatly impact the other die.  Our test condition under 3.4W total power dissipation does not trigger OT protection at 70°C ambient Temp.  Thanks, Jeff

  • Hi Jeff-san,

    Thank you for your explanation.

    I understood.
    By the way, could you please share the above document with me again because I cannot access it ?

    Best regards,
    Kato