TAS6422-Q1: Need TAS6422Q1's Thermal Parameters

Wayne Chen (ex FAE)

Part Number: TAS6422-Q1

Hi Sirs,

Would you pls advise the TAS6422Q1's thermal parameters for customer service:

1. junction to case(top) thermal resistance
2. junction to board thermal resistance
3. junction to top characterization parameter
4. junction to board characterization parameter.

Pls assist us to check the parameters because some of them are not available on the datasheet.

Thank you and Best regards,

Wayne Chen
02/22/2018

over 6 years ago

0 Shawn Zheng over 6 years ago

TI__Mastermind 24835 points

Hi Wayne,
We are looking into this and Dylan will get back to you later.

0 Dylan Yao over 6 years ago

TI__Genius 9140 points

Hi Wayne,

For this device, a heatsink must be used in application, and other thermal resistance is too high compared with Rjc. so Rjc is the only parameter needed for thermal design. We don't have junction to board thermal resistance data, but we have characterization data as row 5, which can be used for calculation if need.

Dylan

0 Wayne Chen (ex FAE) over 6 years ago in reply to Dylan Yao

Guru 15950 points

Hello Dylan,

Do we have chance to know the junction to top characterization parameter? Thanks a lot.

Thanks a lot.

Wayne Chen

02/26/2018

0 Dylan Yao over 6 years ago in reply to Wayne Chen (ex FAE)

TI__Genius 9140 points

Wayne,

I have no idea how much time this characterization work will take, so i need to check with validation team if their bandwidth can support this. Rjc data from thermal design team, so the data can be trusted for customer calculation.

Dylan

0 Wayne Chen (ex FAE) over 6 years ago in reply to Dylan Yao

Guru 15950 points

Hello Dylan, Thanks a lot. Pls inform us preliminary schedule thus we can explain them to customers...Wayne Chen

Audio

Audio forum

TAS6422-Q1: Need TAS6422Q1's Thermal Parameters