This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

  • TI Thinks Resolved

LMV324: LMV324

Part Number: LMV324

hi,

1. The LMV324IDR is used for three op amp instrumentation amplifier circuits. The normal operation of the chip at the first stage of amplification is 14.3 (resistance parameters are the same,
Unusual deviations in the first-level amplification of the chip, eg 16.6 times, 10.2 times)
 Misaligned die soldering is still abnormal on qualified PCB boards.
The abnormal PCB board is normal after replacing the customer's chip.
I would like to ask if this is the quality of my chip or the customer's circuit design?
 Or is the computing range of this LMV324 unable to meet the needs of customers?

2. The suffix of the material previously used by the customer is G4. I now give them LMV324 with G3 suffix. The customer uses G4, and G3 cannot. I would like to ask what is the difference between G3 and G4?
 I have inquired that the G4 was produced overseas. It seems that it is Mexico or Malaysia. The G3 is made in China. Is it?
 If the origin is not the same, but this does not affect the parameters inside there is a big difference can not be used!


 3. I went back to the client yesterday and also took the LMV324IDR tail of the Malaysian origin to test the G4, but it was also the same as the G3 that was sent to the customer before. The magnification was unstable and the fluctuation data was relatively large.
There are 12 bad chips in the 2000 chips, a difference of 800 times.
 I took a test that was given to my own engineer. But it was bad to measure this material, but it did not break down. Now you can help analyze what is the reason.

Thank you.

  • Eric,

    G3 and G4 are packaging codes for materials. This will not affect electrical performance.
    www.ti.com/.../pinout-quality

    Can you share waveforms and a partial schematic?
    Did the misalignment device soldering cause any shorts or opens?

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).

     

  • In reply to Ron Michallick:

    hi,

    Regards,

    Eric

  • In reply to Eric Cui13:

    Hi Eric,

    can you tell more about the supply voltage and the input signals? Also, the schematic shows the LM324, but not the LMV324?

    Kai
  • In reply to kai klaas69:

    hi Kai,

    The peripheral circuits of the LM324 and LMV324 are the same.

    The chip's supply voltage is 5.2V.

    The input signal is the output voltage of the pressure sensor, typically around 15 millivolts.


    Eric
  • In reply to Eric Cui13:

    Hi Eric,

    without knowing more about the circuitry at the input of LMV324 I can only speculate that it has to do with the fact that the LMV324 cannot go fully down to 0V at its output. Eventually you should take an OPAmp which can swing from rail to rail at the output (RRIO).

    Also, the LMV324 has a high offset voltage, which is in the range of your measuring signal. So, you should eventually look for a better OPAmp.

    Kai

  • In reply to kai klaas69:

    Eric,

    To determine gain, at least two measurements are required. Gain = (Vout1 - Vout2) / (Vin1 - Vin2)
    If only one measurement is used, "Gain" = Vout / Vin then the error due input offset voltage will appear to make gain incorrect, especially for low input voltage.

    The total output error (DC offset) due to Vio (Vos) is (U4D[vio]-U4A[vio]) * 7.67 * 11 + U4C[vio] * 11
    Vio is random, on some device the error will higher and adding in the application.

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).

     

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.