Hello,
I am looking to use the AMC1100 in one of my designs and have started looking into the creepage distance on the chip. In the datasheet the creepage distance is defined as 7.0mm as the shortest terminal to terminal distance. In the datasheet creepage distance is defined as "Creepage Distance: The shortest path between two conductive input-to-output leads measured along the surface of the insulation. The shortest distance path is found around the end of the package body." I guess I am having trouble with this definition because in standard 60664 they do not define input and output they only define conductive materials. In the 60664 definition then the creepage distance would be, for instance, the distance between pin 1 and 2 or 2 and 3, which certainly isn't 7.0mm. I must be interpreting the standard incorrectly and would appreciate any light you could shed on my understanding on the definition of creepage distance.
In the datasheet Figure 40 also shows proper layout and the use of an 0603 resistor in series with VINP pin. Certainly the use of a 0603 resistor will also limit the input voltage level because the creepage distance between the pads on the 0603 is very small. Again i am not sure i am fully understanding the definition of creepage and perhaps you can provide me with a link to a TI app note that will help me with this board design.
Thanks,
Brandon