Part Number: OPA2333-HT
Need help to understand the following:
I have procured OPA233-HT with the order code OPA2333SHKJ. This comes in Ceramic Dual Flat Pack (Package code HKJ ). My preferred packaging is SMALL OUTLINE INTEGRATED CIRCUIT (SOIC), which was not in stock at the time of procurement(OPA2333HD). The leads are too long for my application.
1) Can I reduce the length of the leads by cutting it?
2) if yes, by much much?
The leads can be trimmed to whatever length your board manufacturing specifications allow.
One point of reference is TI's HKQ package which is the HKJ package with the leads trimmed and formed.
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In reply to Kirby Kruckmeyer96848:
Thanks for the reply
2) One point of reference is TI's HKQ package which is the HKJ package with the leads trimmed and formed.
the second part of you answer is not clear. Can you please elaborate or re-phase.
In reply to Kiran Gopalaiah:
All I was doing is pointing out that TI task the HKJ package and does a trim and form on it and call it the HKQ package. This is to fit a standard footprint.
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