Part Number: THS7002
Hi TI community,
sorry to bother you with a most probably stupid question ...
For my actual design I am planning to use the amplifier THS7002. But I get confused about the connection of the thermal pad. The PowerPad design considerations recommend the connection to the "internal ground plane".
Is this the same net as "GND-A" and "GND-B" or should the PowerPad have no connection to any pin?
Thanks in advance and best regards,
You can connect the power pad to the same ground plane as GND-A and GND-B. The separate grounds are provided so that you can de-couple the two channels of the amplifiers separately to help reduce crosstalk.
Jacob Freet High Speed Amplifiers
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In reply to Jacob%20Freet:
Hi Jacob, thanks for your quick and precise help!
Many thanks and best regards,
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