TLV2211IDBVR

Prodigy 65 points

Replies: 10

Views: 211

what is the difference between TLV2211IDBVR and  TLV2211CDBV .There is one difference both part number have that temperature difference only in given datasheet. Is there is any other technical details available?

when we use  TLV2211CDBV part number IC our circuit perform right task but when we use  TLV2211IDBVR part number IC their is heating problem occur. so please is any solution available then help us.

10 Replies

  • Binal,

    The data sheet rating and the device symbolization are the only noticeable differences. The "heating problem" is unrelated to the temperature rating or the device symbolization.  Please provide more information about the performance result differences. Waveforms and partial schematic would be helpful. 

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).

     

  • In reply to Ron Michallick:

    Hello,

    Thank for quick reply.
    The problem is when we use VACC symbol IC our ckt give perfect value but when we use VACI symbol IC ,heating problem was occurred.As per your application option both the symbol IC is similar for working purpose.
    Please find attached SCH & Reply ASAP.
  • In reply to Binal Patel:

    Binal,

    Does "heating problem" describe the temperature of the TLV2211 package or something else?

    Does this happen on just one sample of "VACI" or multiple samples?

    The only 'red flag' in circuit is that the output appears to go to a connector. This increases the chance to that TLV7211 will see ESD or EOS (electrostatic discharge, electrical over stress)

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).

     

  • In reply to Ron Michallick:

    Ron,

    We don't understand the first sentence please elaborate in detail.

    The temperature reached around 85 to 100 degree Celsius. it happens in all the VACI sample IC.

    We already check there is no issues in ESD or EOS.

  • In reply to Ron Michallick:

    Hello Ron,

    Can we take a skype call or call for this IC solution because our R&d work is getting delay for this problem?. If it is possible then let's take a call on Monday so that  we can figure out the solution for our R&D work.

  • In reply to Binal Patel:

    Binal,

    I will explain the "first sentence" again. I do not know what "heating problem" means. Does it mean that the op amp op becomes hot when operating?  

    Voltage measurement or waveforms at a few nodes for both normal operation and abnormal operating will be very helpful and should be posted before any conference call so I have time to study the data..  

    Useful nodes  [U4B pin7, U2pin 1, OP1 pin 1, VR1 pin 2 , U2 pin 4]

    With power off measure resistance on OP1 pins 1 and 2.  Normal would be 22k; if not 22k on a good board change resistance range on meter to get 22k then check not good board.

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).

     

  • In reply to Ron Michallick:

    Ron,

    We have measured the resistance in between VDD+(PIN no 5) and VDD−/GND(PIN no 2).

    Case 1 (working PCB with Symbol VACC/ Part no. TLV2211CDBV): The resistance measured is in increasing manner and goes up to mega-ohms (this is perfectly working PCB)

    Case 2 (not working PCB With Symbol VACI/ Part no. TLV2211IDBV ): the resistance is measured 82 kilo-ohms (this is the heating problem PCB). 

  • In reply to Binal Patel:

    Binal,

    I will try your test in the lab. I need to order sample parts to do this test. If they arrive early , I can try on Friday, otherwise it will be Wednesday. The power supply is likely common to other circuits in board, so it is uncertain if the 82k comes from the TLV2211

    Gentle reminder that I do not have answers to my questions in my previous post. 

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).

     

  • In reply to Ron Michallick:

    Ron,

    We order both part number IC and test it on our PCB .Both are working properly.

    In our past order we order 300 TLV2211IDBVR IC but not even single IC work properly so i thing IC manufacture problem is there in that slot.

  • In reply to Binal Patel:

    Binal,

    I checked my samples with a DMM and the result was "overload" resistance. I also ran a supply current vs supply voltage check.

    No differences were observed (overlapping curves). Supply current versus supply voltage.

    Regards,
    Ronald Michallick
    Linear Applications

    TI assumes no liability for applications assistance or customer product design. Customer is fully responsible for all design decisions and engineering with regard to its products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning Customer's design. If Customer desires engineering services, the Customer should rely on its retained employees and consultants and/or procure engineering services from a licensed professional engineer (LPE).