THS3062: Having a problem with op amp overheating and shortened lifespan
Part Number: THS3062
The third question is in addition to the first two I already posted regarding the same subject.
1, Could solder voids (on the power pad) cause overheating and shortened lifespan? Is there a specification for the maximum void on the power pad where overheating could lead to shortened lifespan?
2. If the power pad design did not include the recommended five, 10 mil diameter vias, (I.E. If only one or two via's went through the power pad to ground plane or other), could this cause overheating and shortened lifespan?
3. Additional question: We have been measuring the external package temperature. The nominal value for the package temperature that we have deemed acceptable is 65C. Is this acceptable?
Jacob Freet High Speed Amplifiers
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In reply to Jacob%20Freet:
65C is the package temp. The ambient temp is 24C (75F).
Thank you. Tom
I just wanted to update you that I have submitted a request to our thermal modelling team for the DGN package. The datasheet is older and only has the Theta JA and JC values which aren't great estimates to get junction temperature compared to newer standards. It could take up to two weeks to get the new numbers, but then I will be able give you a much more accurate calculation for the device temperature.
That could prove very beneficial to our analysis. Thank you very much.
The product is in our old and current designs and is being designed into future products as well.
In reply to kai klaas69:
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