On the tech sheet, there are two part numbers...
OPA2614IDG4 and OPA2614ID
What does the G4 designate?
Also, It says that heat sinking may be required....however, there is no pad on the bottom. How would you heat sink such a small chip with no pad underneath it?
The OPA2614IDG4 would be the same as the OPA2614ID, the G4 is the designator to indicate that the device was finished with a "Green" mold compound.
G4 being the replacement of the E4 Category finish, as the G represents the use of a "Green" mold finish.
More information on this can be found at http://focus.ti.com/quality/docs/gencontent.tsp?templateId=5909&navigationId=11753&contentId=5055
For the heat-sink, the device had a package with a pad on the underside; however that package is no longer in use for this part (HSOP-DTJ). Currently with the available package you may use a heat-sink on the device by attaching it to the top of the IC if a heat-sink is necessary in your design.
Please let me know if you have any further concerns.
Ranji C. Bhola
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