THS3062 - junction to pad thermal resistance

Johannes Neumann

Other Parts Discussed in Thread: THS3062

Hello,

we are currently creating a thermal simulation model for one of our products that features the THS3062DDA.
The SLMA002G PowerPad Application Report mentions how the individual thermal resistances (e.g. junction to ambient, junction to case) are measured/simulated. However, the THS3062 datasheet only ever states the junction to ambient resistance when mounted on a 3"x3" pcb. The other values are not mentioned.

Our product features a water cooling system - hence we need the junction to pad resistance. Which I can't find anywhere.

Can you point me to a resource for the junction to pad resistance?
Thanks in advance,

Johannes Neumann

over 8 years ago

0 Samir Cherian over 8 years ago

TI__Genius 12631 points

Hello Johannes,
I have requested the modeling group to generate this. I hope to get the result in 2-3 days. I will send you the updated information once I receive it.
-Samir

0 Johannes Neumann over 8 years ago in reply to Samir Cherian

Prodigy 50 points

Hello Samir,
any news on this?

One more thought:

Almost all materials and dimensions are known. So I could alternatively make my own simulations and get a rough estimate of the junction-to-pad resistance. Unfortunately the die attach material is not mentioned and contributes a large part to the resistance. It would help to know the material used for the die attach layer.

Thank you!
- Johannes Neumann

0 Samir Cherian over 8 years ago in reply to Johannes Neumann

TI__Genius 12631 points

Hello Johannes, I was informed by the modeling team that the data would be available by the end of the day. Do you still want the die-attach information?

0 Johannes Neumann over 8 years ago in reply to Samir Cherian

Prodigy 50 points

Hello Samir,
thank you for your reply. Yes, the die-attach information would be very valuable to verify my simulations.
Regards
- Johannes Neumann

0 Samir Cherian over 8 years ago in reply to Samir Cherian

TI__Genius 12631 points

Hello Johannes,

Here are the updated model values:

Result-Theta JC, top (standard datasheet value):	55.9
Result-Theta JB (standard datasheet value):	30.8
Result- Psi JT (standard datasheet value):	11.0
Result- Psi JB (standard datasheet value):	30.7
Result-Theta JC, bottom (standard datasheet value):	6.4

-Samir

0 Johannes Neumann over 8 years ago in reply to Samir Cherian

Prodigy 50 points

Thank you very much! Exactly what I have been looking for!

0 Johannes Neumann over 8 years ago in reply to Samir Cherian

Prodigy 50 points

Hello Samir,
could you give me some information about the materials used for the die attach?
Regards,
- Johannes Neumann

0 Samir Cherian over 8 years ago in reply to Johannes Neumann

TI__Genius 12631 points

Hello Johannes,
We are using a SID#101374994 from Henkel-Ablestik.

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THS3062 - junction to pad thermal resistance