Hi
I have two questions:
1) Is the DAP a pad under the IC that need to connect through the pcb copper pad to the most negative voltage? Can I not have a pad for the DAP and let it be open?Can I just connect Vee pins to the -ve voltage?
2) My input is only signal that is +/-1V maximum, can I connect Vee=-3.3V, Vcci=+3.3V, Vcco=+2.5V for LVDS output? With these low voltage, do I still need the DAP solder to pcb for heat sink?
Thanks
Alan