Hi,
One of customers is using a cascade of 5 THS4513-SP in one of their designs. i.e. output of one feeds the input of the other. While doing the layout, they etched out the ground layer(layer 2) below the whole IC to prevent any parasitic capacitance in the signal path. While doing so, they have routed the signals under the IC body on the top layer to achieve compact routing.
As the IC draws 40mA supply current, the thermal dissipation needs to be accounted for and thus a copper pad needs to provided under the body of the package and connected to ground planes using vias. Since they have not provided it, I am concerned about the thermal performance of the device.
Can you please confirm if this copper pad is needed?
This is an urgent matter.