This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: THS6184
can somebody explain why the QFN vs. the HTSOP package has such a high difference:
although both devices have an exposed pad does nto explain the delta of more than 10x
Is there an alternative device providing:
bandwidth is probably too high and current feedback provide high offset, lower woudl be better. Estimated PD *1.2 Watt
In reply to Rohit Bhat:
Received the following updated thermal characheristics to be added to the Datasheet
The PWP (HTSSOP) thermal model is finished, and the θjc to the top of the case = 23.9 °C/W as shown below, which is a little lower than the 27.5 °C/W in the PDS. The θjc to the power pad (bottom of the case) = 1.7 °C/W as shown below.
Apparently, the PDS has the HTSSOP θjc to the top of the case and the QFN θjc to the bottom of the case. I think the HTSSOP should be changed to the bottom of the case. The θJA is more relevant to the customer, and those numbers are close for the two packages as shown below.
Device Name THS6184RHFT
No of Pins 24
Package Designator RHF
Leadframe (or substrate) Number - 7 digit 6448517
Is it Stacked Die or MCM ? No
Die Size(s) and Description(s) 2528.062 x 3221.99
Result- Theta JA-High K (standard datasheet value) 33.4
Result-Theta JC, top (standard datasheet value) 23.1
Result-Theta JB (standard datasheet value) 11.7
Result- Psi JT (standard datasheet value) 0.3
Result- Psi JB (standard datasheet value) 11.6
Result-Theta JC, bottom (standard datasheet value) 1.0
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.