LM7372: LM7372 and THS3112 theta-JC (thermal resistance, junction to case)

Hi Russell,

We just sent a modeling request to the thermal modeling team, which typically takes 3-4 days. We will get back to you when we hear from them. Do you need theta-JC for the SOIC-8 D package, the DDA (thermal pad) package, or both?

Best regards,

Sean

Hi Sean,
Both would be great. Also, I've discovered in our application that the thermal pad on the DDA package is not being used (i.e., the board does not have thermal feature to support it). Could you give a theta-JC or theta-JA for that case?

Thanks!

Russell

Hi Russell,

A DDA package with an unattached thermal pad is the thermal equivalent of a D package.

For the THS3112 D Package: Theta JA=107.8; Theta JC, top=48.8; Theta JB=51.1; Psi JT=8.7; Psi JB=50.4. I am still waiting on the DDA.
For the LM7372, the DDA package is 8 pin (LM7372MR/NOPB), but the D package is 16 pin (LM7372IMA/NOPB). I requested both and am still waiting for a response also.

Best regards,

Sean

Hi Sean,

Where are we with the pending info from above?

Thanks!

Russell

Hi Russell,

LM7372IMAX (D Package, 16 Pins): Theta JA=60.8; Theta JC=24.5; Theta JB=24.4; Psi JT=1.0; Psi JB=24.2.

Still waiting on the other two.

Best regards,

Sean

Hi Russell,

THS3112CDDA: Theta JA=40.1; Theta JC, top=60.3; Theta JB=14.0; Psi JT=3.8; Psi JB=14.2; Theta JC, bottom=4.4.

I'm still waiting on the last one.

Best regards,

Sean

Thanks Sean!

Any idea when the last bit of info will be coming in?

Russell

Hi Russell,

LM7372MR/NOPB is still in the thermal modeling request queue. When it is completed, I will pass on the information to you immediately.

Best regards,

Sean

Hi Sean,
Just wanted to follow up here. Do you have an ETA for when the model will be complete? Thanks!

Russell

Hi Russell,

I just called the Thermal Model analyst, he said he'll have it by the end of the week.

Best regards,

Sean