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  • TI Thinks Resolved

OPA2333: OPA2333

Part Number: OPA2333

Hi team,

    my customer has a question when using OPA2333. We have an exposed  pad in the middle of the device and as the datasheet says, it's for "thermal and electrical characteristics". And we need to connect the pad to VS- as well as the thermal pad in PCB. I can understand that the it will improve thermal dissipation, but how to understand that this will benefit for electrial and mechanical and improve reliability? Can you explain in more details?

    Thanks !

  • In addition to better thermal characteristics, the exposed thermal pad of OPA2333 provides improved package integrity which minimizes bending/warping of the package due to power dissipation inside the package and caused by different temperature expansion ratio of various materials used for packaging like silicon die, lead frame and molding compound.  Since the exposed thermal pad minimizes such physical changes to the package, this leads to improved electrical characteristics as well as provide higher long-term reliability of the part.

    Marek Lis, MGTS
    Sr Application Engineer
    Precision Analog - TI Tucson

  • In reply to Marek Lis:

    Susan

    It appears your question has been resolved. Please post again if you have any other questions.

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