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OPA2134: OPA2134 Thermal information

Ryuuichi machida
Guru 11505 points
Part Number: OPA2134
Other Parts Discussed in Thread: OPA134,

Hi,

I would like to confirm following information.

* Rθja, Ψjt and Ψjb

It seems that there is no information about thermal information in datasheet.

At least, could you please confirm whether you can provide above data ?

Best Regards,

Machida

  • 0
    TI__Guru* 93105 points

    Hello Machida,

    We do not have the thermal numbers for the OPA134 and OPA2134 op amps. They were designed and characterized a couple of decades ago. I suspect their thermal performance was determined to be safe over their specified operating temperature range and when operated under normal conditions. 

    We might be able to provide you with some approximations of Rθja, Ψjt and Ψjb based on similar products, if they are available in the same package. Which package type were you planning on using?

    Regards, Thomas

    Precision Amplifiers Applications Engineering

  • 0 in reply to Thomas Kuehl
    Guru 11505 points
    Hi Thomas-san,

    Thank you for your reply.
    >Which package type were you planning on using?
    Customer will use SO-8 pacakge.
    Could you please confirm for above package ?

    Best Regards,
    Machida
  • 0 in reply to Ryuuichi machida
    TI__Guru* 93105 points

    Hello Ryuuichi,

    A request has been submitted to have the thermal parameters for the OPA134 and OPA2134 SOIC package devices determined. As soon as we receive the information from Packaging Engineering I will post it here for you. I expect we will have it within a week.

    Regards, Thomas

    Precision Amplifiers Applications Engineering

  • 0 in reply to Thomas Kuehl
    Guru 11505 points

    Hi Thomas-san,

    Thank you for your reply and response.

    >A request has been submitted to have the thermal parameters for the OPA134 and OPA2134 SOIC package devices determined.

    Thank you for correcting me. You are correct. I mistook package type.(I wanted to request SOIC not SO (OPAx134 do not have this package.))

    Please keep watch on progress.

    Best Regards,

    Machida

  • 0 in reply to Ryuuichi machida
    TI__Guru* 93105 points

    Machida-san,

    The thermal information for the OPA134UA and OPA2134UA devices has been derived by our Packaging Engineering team. Here are the results:

                                                                                                        OPA134UA          OPA2134UA                                     

    RθJA         Junction-to-ambient thermal resistance                     112.9 °C/W          106.9 °C/W

    RθJC(top)   Junction-to-case(top) thermal resistance                   52.4 °C/W            48.1 °C/W

    RθJB         Junction-to-board thermal resistance                          57.1 °C/W            50.8 °C/W

    ψJT          Junction-to-top characterization parameter                  10.9 °C/W             8.0 °C/W

    ψJB          Junction-to-board characterization parameter              56.3 °C/W            50.0 °C/W

     

    Regards, Thomas

    Precision Amplifiers Applications Engineering