TI E2E Community
: Moulding of IC 555 with Araldite Resin (AY103) & Hardner (HY951)
We have been using IC555 in one of our application where in PCB is moulded with the Araldite, since unit is fully immersed in ATF (Aircraft Turbine Fuel) hence moulding is essential to protect electronics to come in contact directly with ATF. In view of above it is requested to kindly confirm that IC 555 can be moulded with the Araldite. In case, if araldite is not suitable then can you please suggest suitable material for moulding which is ATF resistant also? We shall be gratefully if you could kindly give your comments on the above at the earliest.
I will connect you to the team that supports IC555 within TI. Can you please confirm the TI part number you are using? I believe it is TLC555.
Please provide the full part number. I will forward the request to the packaging engineer.
Regards,Ronald MichallickLinear Applications
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The correct and exact part no of use is LM555J/883 Ceramic Dip package. Awaiting your reply.
Hi Ron Michallick,
I am waiting for your reply.
I transferred this request to the National team. With the new years holiday, I expect earliest response on January 3.
I made another contact to NSC timers. Hopefully they will respond.
Ajay, I have checked around within TI and NSC.
Here is our best answer.
Based on the composition information available I do not believe the epoxy will damage the hermetic ceramic package. Apparently it is quite common to use as a potting compound for electronics. When cured it is translucent yellow and very hard. The only caveat is that the customer should run ESS qualification to make sure that the module and components are not overstressed due to TCE mismatch.
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