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TI Home » TI E2E Community » Support Forums » Applications » Medical & High Reliability » Medical & High Reliability Forum » SM470R1B1M - power dissipation
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SM470R1B1M - power dissipation

SM470R1B1M - power dissipation

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Jean_michel James
Posted by Jean_michel James
on Nov 21 2011 08:59 AM
Prodigy145 points

Hello,

 I can not find any information about power dissipation of the SM470R1B1M in the CQFP84 package.

Where can I find any information about the thermal junction between the die and the package ?

Regards,

JM

SM470R1B1M
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  • R.A. Pauley
    Posted by R.A. Pauley
    on Nov 28 2011 13:08 PM
    Verified Answer
    Verified by Jean_michel James
    Prodigy460 points

    Good afternoon Jean_michel. Many apologies for the lack of thermal data you require. We will work to correct that.

    For now, The SM470R1B1MHFQ  has a Tjc (bottom) of 1.48C/W. Tja to JEDEC 51-5 criteria is 28.7C/W. I hope this is the information you need.

    Best Regards,

    Andy Pauley

    Texas Instruments

    HiRel Packaging and Reliability

     

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  • Jean_michel James
    Posted by Jean_michel James
    on Jul 25 2012 05:26 AM
    Prodigy145 points

    Thanks for the answer,

     I do mount the processor on a thermal pad as recommended with gull wing lead, can you give me a typical value for the case to ambiance thermal resistance ?

    JM

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