Hello,
I can not find any information about power dissipation of the SM470R1B1M in the CQFP84 package.
Where can I find any information about the thermal junction between the die and the package ?
Regards,
JM
Good afternoon Jean_michel. Many apologies for the lack of thermal data you require. We will work to correct that.
For now, The SM470R1B1MHFQ has a Tjc (bottom) of 1.48C/W. Tja to JEDEC 51-5 criteria is 28.7C/W. I hope this is the information you need.
Best Regards,
Andy Pauley
Texas Instruments HiRel Packaging and Reliability
Texas Instruments
HiRel Packaging and Reliability
Thanks for the answer,
I do mount the processor on a thermal pad as recommended with gull wing lead, can you give me a typical value for the case to ambiance thermal resistance ?