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TI Home » TI E2E Community » Support Forums » Applications » Medical & High Reliability » Medical & High Reliability Forum » All Tags » Hirel
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Medical & High Reliability

Welcome to the Medical & High Reliability Section of the TI E2E Support Community. Ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers. To post a question, click on the forum tab then "New Post".

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Hirel
  • ADS1278-HT
  • bare die
  • HEAT EVM
  • Hi rel
  • High Temp
  • HT
  • -HT
  • Opa
  • SM470
  • subnarine
  • telecommunication
  • TMS320C6678
Related Posts
  • Forum Post: Powering the SM470 / ADS1278 / HEAT EVM

    Rob Wilson Rob Wilson
    As I am digging deeper to the development of HT board, I have found some issues on conflicting power requirements and sequence on SM470R1B1M and ADS1278. They both need 3.3V and 1.8V and ADS1278 need a AVDD 5V. Here is the issue, For SM470R1B1M, 3.3V should reaches 1.1V before 1.8V reach 0.6V;...
    on Sep 23, 2011
  • Forum Post: Re: HiRel Suffixes Defined: -EP, -SP, -HT

    David Moon David Moon
    Brian, To address your request for clarification on the qualification differences between our Space (i.e. –SP), Enhanced Products (i.e. –EP), and High-Temperature (i.e. –HT) parts, allow me to provide the following explanation: TI has comprehensive signal-chain portfolio solutions...
    on Dec 23, 2011
  • Forum Post: High rel application for OPA340MDBVTEP

    Giulia Salmini Giulia Salmini
    I'D like to have relability prediction for OPA340MDBVTEP at 25years. The application I'm working on is a submarine appliaction. Do you have data from field or extarpolated data from life test? Application maximum ambient temperature is 35 C. Thank you Giulia
    on Apr 10, 2012
  • Forum Post: HKJ Thermal Resistance

    Jim Riche Jim Riche
    Whta is the case to ambient thermal resistance for the HKJ package?
    on Dec 7, 2011
  • Forum Post: Reliability Data for CD74HC

    Ahsan Saddique Ahsan Saddique
    Would you be able to provide reliability data (FIT, confidence level, activation energy, stress temp, usage temp) for CD74HC series devices. There is no reliability data available for these device on TI website. Is data for one device is also applicable to another device of same family. Thanks in...
    on Dec 5, 2012
  • Forum Post: RF components in die/wafer availability?

    J Swartz J Swartz
    Sorry if this isn't the best forum - Hi-Rel seems to contain "Die/Wafer... I am working on advanced RF applications, moving some existing designs to MMIC, flex PCB, and ultra-small integrations. I have two designs using the CC1101, and would like to build a MMIC version using a CC1101 die...
    on Feb 14, 2013
  • Forum Post: TMS320C6678 Hi-Rel hi-temp version

    Matt Hosler Matt Hosler
    I believe that the TMS320C6678 was being qualified as part of the their HiRel family. Has it been determined yet what the clock rate at temperature will be?
    on Mar 22, 2013
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