This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: OP27
comparing the internal schematic of the TIs OP27 shown in the data sheet with the OP27 of Analog Design one can see that the TIs OP27 Amplifier is depicted with a pure NPN bipolar transistor output stage where the ADs shows a complementary design in its data sheet. This difference would yield a voltage amplification factor higher than 1 (how much ?) and a signal inversion at the output pin with the TIs design..
A higher voltage amplification factor of the output driver stage would yield smaller voltages and voltage stress over the internal frequency compensation MOS-capacitors, which can be favorable.
Sincerely, Christian Daniel
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
In reply to Christian Yots:
Many thanks, all NPN output stage convinces me ! This means there must be an inversion inside the output stage wherefor the connections of the bases of Q21 and Q22 must be exchanged. In the schematic in the datasheet both transistors Q21 and Q22 are connected to the same collector of the input transistors - correct ?
Q3 shows an inverted NPN - intention ?
Does the minor internal changes of the OP27 have any (positive) effects on the Singe Event Gate Rupture (SEGR) hardness of the internal feedback MOS-capacitors ?
Greetings, Christian Daniel
In reply to Christian Daniel:
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with respect to these materials. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.