• TI Thinks Resolved

SN74LVC2G74-EP: SN74LVC2G74MDCUTEP

Part Number: SN74LVC2G74-EP

We sent these parts out for construction analysis as a step to upgrade the part for our application.

The report identifies an issue with the metallization coverage . The "via hole" plating does not

meet criteria. We have as little as .07 um plating and the best being only .13um. This ranges 8-13%

of the overall metallization thickness. It is expected to be at least 25% of overall thickness. Would this 

coverage be within the required thickness for performance of this device?