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RM57L843: Radiation Hardened Version

Part Number: RM57L843
Other Parts Discussed in Thread: TMS570LC4357

Hello,

is it possible to provide a Radiation Hardened Version of this www.ti.com/.../RM57L843 MCU?

kind regards

 Konstantin

  • Hello Konstantin,

    I don't believe we have a radiation hardened version of any of our Hercules devices. To be certain, I am going to move your post to our High Reliability (HiRel) E2E. The HiRel group is the group within TI that will take standard off the shelf devices and make updates such as ball replacement, extended temp range, etc to accommodate specific industry needs.
  • Konstantin,
    We are currently evaluating Hercules devices for possible release for either ceramic Class V (-SP) or Space enhanced plastic (-SEP).
    We do not have ability to modify design, but we do have some ability to modify the wafer fabrication process to mitigate SEL. I will have someone on our marketing team contact you to get any details that may help.
    Regards,
    Wade
  • Hope to hear more about it.

    So that's means to my company that we might start developing with Hercules devices
    and delay lift-off until some modified wafer fabrication process has lead to some Space-grade Versions.
    That are good news because a lot of other Space-grade MCU's have a bit limited capabilities.
    Regards
    Konstantin
  • Konstantin,

    I want to also address the part number you have identified, RM57L843. This part number is from our industrial line of products within the Hercules family of devices. If you will need proven in use data from a significant source of use cases (generally automotive use cases), we strongly recommend use of the automotive version, TMS570LC4357. Out industrial applications tend to be lower volume and are not capable of provided the rich history of proven in use data that our auto grade units can provide making use in a DOxxx compliant application difficult.