Hello,
We have a customer who is asking the following:
"I'm interested in obtaining information on the junction to board and junction to case thermal resistance for the OPA333AMDBVREP component. Additionally, what is the max rated junction temperature this component can operate in? I've been looking through data sheets for this component, but can't seem to find this information. Can you please help me obtain this information to support a design with this component?"
Could someone please have a look into this?
Thank you,
Gabe Garza
TI Customer Support
