I am specifying a INA333SHKJ component for a new high-temperature down-hole design. The datasheet shows two versions of the ceramic part (one with long leads) and the other gull-winged. The part I plan to use is the one with the long straight leads. I am assuming (maybe incorrectly) that the leads can be trimmed down close to the body of the part and used that way. Or was this intended to be lead-formed by the end-user into a gull-wing package? In any case, I would appreciate some guidance as to recommended PCB footprints for this device.
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