Part Number: PMP40025
one of my customer working on PMP40025 design,
Regarding heat sink for switching MOSFET: In the image given in TI Web, no heat sink is provided for MOSFET (image attached), In their rough calculations they got around 71 mW losses (including switching) .
please help to advise about heat sink for MOSFET. customer planned to use
For primary MOSFET, TO-220 package thermal resistance is 62.5 oC/W according to TOSHIBA datasheet. therefore, the temperature rise will be small. There is no need to add heat sink on MOSFET normally. What is the customer application ambient temperature?
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