Regarding AM3352BZCZA60 (-40 to 105C), customer concerned about long term reliability and requested the following information:
I assume this part is OPP100. Based on data sheet http://www.ti.com/lit/ds/symlink/am3351.pdf, p. 82 POH is 100K hours.
1. What happens after the POH rating? What degrades or fails?
2. What is the Lifecycle vs. Junction Temperature for AM3352? Please provide characterization tables or curves.
3. What is the lowest operating frequency the A60 can run down to? Customer wants to use A60 (lower cost than T60) and would lower the operating frequency as the junction temperature rises to stay below the 105C Tjmax.
4. What additional power management techniques can be deployed to lower the Tj – shut down peripherals, etc?
5. Customer did not plan to use a heat sink, but if that would help, what heat sinks does TI recommend? Are there any heat sinks that are known to be compatible with the ZCZ package?
6. Is AM335x used in automotive applications and how do those customers deal with these reliability questions?
Customer ambient is -40 to 85C and convection cooled. The AM3352 board is inside of a vented plastic case that is placed inside of an enclosed, non-ventilated metal control box.
Thanks,
Brian