Part Number: TPA3251
My customer design a audio amplifier, they have two board: signal and speaker amplifier board.
Customer can't confirm Which way is better when SE to DIFF input stage circuit is placed as close as TPA3251 board or signal board. Can you give some suggestion ? thanks
We've never tested placing the SE to DIFF input stage circuit at different distances. As long as the signal route has minimized picking up any additional noise from the system or environment then I don't foresee issues with how far the op-amps are placed relative to the audio amplifier, within reason.
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In reply to Robert Clifton56:
If the GND of signal board and amplifier board don't be tied together, is there any influence when the SE to DIFF stage circuit be place different board ?
In reply to aggil liang:
Why aren't the signal board's and amplifier board's ground being tied together?
Which way of PCB LAYOUY is better? Is it ok if I choose the second way
Only a assumption.
Thank you for showing me the system Dunhai!
Both methods are vaild. While I believe option one will likely have lower noise floor, if good routing practices and ground pour techniques are used, option 2 appears should give similar results.
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