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TAS5424C-Q1: About a contact area of Exposed Thermal Pad and the heat sink

Toshiyuki Murakami
Prodigy 90 points
Part Number: TAS5424C-Q1

Hi,

I ask about a contact area of Exposed Thermal Pad and the heat sink of TAS5424C-Q1.
I use DKE package.
(1)Please tell me the minimal value of the contact area (area) with the heat sink. I want to confirm it whether you cannot show heat radiation effect when you do not let you come all into contact whether it is all right to some extent.
(2)I regard contact as heat sink through grease for the heat radiation. Please tell me if I understand the smallest range where application is necessary for for a pad.

Best Regards.

Toshiyuki Murakami

  • 0
    TI__Genius 9140 points

    Toshiyuki-san,

    (1)Please tell me the minimal value of the contact area (area) with the heat sink. I want to confirm it whether you cannot show heat radiation effect when you do not let you come all into contact whether it is all right to some extent.

    [Dylan] The largest heatsink contact area is 80mm2. If customer can't meet that, then the thermal resistance should be calculated by the actual contact area.  TI can't say minimum contact area, because it depends on customer system thermal resistance, which include thermal conduct material between device and heatsink, heatsink resistance, and also the actual power dissipation should be considered. If power dissipation is quite, that could be also fine. 


    (2)I regard contact as heat sink through grease for the heat radiation. Please tell me if I understand the smallest range where application is necessary for for a pad.

    [Dylan] Yes, the contact is through grease between heatsink and device.

    Dylan

  • 0 in reply to Dylan Yao
    Prodigy 90 points

    Hi,Dylan

    Thank you for an answer.
    As I do not understand an answer to question (2), I change a question sentence.

    I examine use of grease for the heat radiation to bury contact interspace of heat sink and Exposed Thermal Pad. Please tell me if I understand the smallest range where application is necessary for for Exposed Thermal Pad.

    Best Regards,

    Toshiyuki

  • 0 in reply to Toshiyuki Murakami
    TI__Genius 9140 points

    Hi Toshiyuki,

    I still didn't understand the sentence.  Do you mean what is the minimum contact area with exposed thermal pad?  To improve the communicate efficiency, let's offline use email to talk about it.  Please send a email to me to confirm i understand your question correctly?

    Dylan