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TPA3116D2: Moisture-proof coating on PAD

Part Number: TPA3116D2

When moisture-proofing the board assembly,
Is it okay to add moisture-proofing agent to thermal PAD?
Moisture-proof agent, AY-1502 (Sunhayato, polyvinyl is based)
Solvents are alcoholic (ethanol based, HCFC141, propyl alcohol added)

* No heat sink is mounted on the IC.
It has been confirmed that there is no problem with the heat generation and power of the IC.

Since the material of the moisture-proof agent also thing that was also common solvent, I believe that's okay.
But, usually because those that do not painted in the thermal pad, please tell me there is no problem.