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TPA3116D2: About the availability of coating agents

Part Number: TPA3116D2

Customer want to apply moisture-proof coating around the reed foot. Power dissipation pad on top of PowerPAD package
Is there any problem even if the coating agent adheres?

Check for harmful effects such as deterioration of the packaging material, penetration into the pad and plastic parts, cracks, etc.
Could you answer it?

  • Hi Akira,

    Sorry, I can not understand your mean completely. 

    The thermal pad is under the device, it is soldered on GND plane on board.

    Do you mean that customer wants to add moisture-proof coating on the thermal pad?

    Regards,

    Derek

  • Hi Derek

    Sorry for the lack of explanation.
    The product that the customer is considering is "TPA3116D2DADR", and the data sheet states that there is a heat dissipation pad on the TOP side.
    The customer wipes the lead with a moisture-proof coating, but the coating agent may also adhere to the heat dissipation pad on the TOP side. Is this acceptable? Please confirm it is.
    (Is there a risk that the coating agent will penetrate the interface between the heat dissipation pad and the mold and cause cracks?)

    Regards,

    Akira Kagiwada

  • Hi Akira,

    I think if the stress from heat-sink to device is controlled well, the application is fine.

    Regards,

    Derek