This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Part Number: CDCUN1208LP
we are facing some challenges during the SPI communication with the device.
Things are looking now working, but out of the datasheet there are gray area:
in our first attempt we implemented the SPI write as it is shown in figure 32 on page 30 of the data sheet. There were the following differences:
This seemed to work, but later on we found out that it was not reliable. According to section 184.108.40.206 the chip operates on the rising edge of SCL, but the timing t6 in table 9 suggests that the chip operates on both edges (by the way: I would expect a max delay specification for t6 instead of a min delay). As it is not allowed to toggle SCL while SCS is high, my conclusion was that the falling edge of SCL has to be applied before SCS is released and that timing t8 also applies for the falling edge of SCL.
So the new implementation switches the SCL to low first and de-asserts SCS later. With this new implementation there are no issues so far.
Can you please review and let us know if you have suggestions for further improvements?
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
To design your own Clock Tree solution, visit WEBENCH Clock Architect !
More information Clock and Timing System products: http://www.ti.com/clock-and-timing/overview.html
In reply to Shawn Han:
thanks for your inputs.
can you please clarify the following points:
I have taken a closer look to the table 9 :
In reply to Sunset:
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.