Hi !
I would like to know the junction temperature for different ambient temperatures. I did some measurements using a thermocouple on the die, and using the thermal table on the datasheet and the application report linked (Semiconductor and IC package thermal metrics), it seems that I need to use the Junction-to-top characterization parameter. But with a value equal to 0.2°C/W, there is barely no difference betwen the junction temperature and the case (top) temperature.
Is therre a mistake with that value ? Or maybe I misunderstood the application report ?
Thanks
Stephane