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Part Number: LMK05028
Customer wants to know if LMK05028 can release heat from top fin. Will the sticking glue and heat sink affect the clock performance?
Can you give a comment?
By default, most of the heat goes through the ground pad. As you can see from the datasheet the psiJT = 0.1 deg C/W and psiJB = 4.8 deg C/W. So most of the heat goes out the bottom.
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In reply to Timothy T:
I wasn't able to get any specific case for how much the heat dissipation could be improved.
Note that there is direct metal connection on the bottom of the IC with the DAP. One tip for best thermal dissipation is to remove the soldermask beneath the device to help dissipate heat. In fact, if you were to connect a heat sink to the bottom of this, this may be good also for thermal dissipation.
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