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LMK05028: One question about LMK05028

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Replies: 2

Views: 93

Part Number: LMK05028

Hi,

Customer wants to know if  LMK05028 can release heat from top fin. Will the sticking glue and heat sink affect the clock performance?

Can you give a comment?

Thanks.

  • Hello Oliver,

    By default, most of the heat goes through the ground pad.  As you can see from the datasheet the psiJT = 0.1 deg C/W and psiJB = 4.8 deg C/W.  So most of the heat goes out the bottom.

    • Placing a heat sink on the top would change these numbers to allow more heat from the top.  I will check to see if I can find some guideline of how much it could help.
    • I'm not aware of any issues with clocks from a heat sink attached to the top.
    • You would want to take care for mechanical stress to the solder joints.

    73,
    Timothy

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    To design your own Clock Tree solution, visit WEBENCH Clock Architect​​​​
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  • In reply to Timothy T:

    I wasn't able to get any specific case for how much the heat dissipation could be improved.

    Note that there is direct metal connection on the bottom of the IC with the DAP.  One tip for best thermal dissipation is to remove the soldermask beneath the device to help dissipate heat.  In fact, if you were to connect a heat sink to the bottom of this, this may be good also for thermal dissipation.

    73,
    Timothy

    ____________________________________________________________________________________

    To design your own Clock Tree solution, visit WEBENCH Clock Architect​​​​
    More information Clock and Timing System products: http://www.ti.com/clock-and-timing/overview.html

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