Should the thermal pad of clock buffer CDCLVD1204 be connected to GND? Thank you very much.
Yes, it should be connected to ground as per page 10 of the SCAS898A datasheet. The device package has an exposed pad that provides the primary heat removal path to the printed circuit board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The Thermal Pad must be soldered down to ensure adequate heat conduction to of the package.
Yes, it should be connected to ground as per page 10 of the SCAS898A datasheet.
The device package has an exposed pad that provides the primary heat removal path to the printed circuit board
(PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a
ground plane must be incorporated into the PCB within the footprint of the package. The Thermal Pad must be
soldered down to ensure adequate heat conduction to of the package.
Thank you.
You know that CDCLVD1204 is a LVDS clock buffer, but one receiver of CDCLVD1204 is HCSL receiver.
Could you please tell me how to connect it to HCSL receiver? Thank you very much.
Hi Jason,
Sorry for the late reply. Please find attached some examples of interfacing HCSL to LVDS for the CDCLVD1204.
Best regards,
MJ7382.HCSLtoLVDS.pdf